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Many surface mount headers and socket strips
are available on .050" (1,27mm) pitch for board stacking applications.
These are available with both shrouded and unshrouded construction. Dual row shrouded interconnects (TFM and SFM Series) are available with tails on .050" (1,27mm) pitch. Board densities can be further improved with unshrouded headers (FTS and FW Series) and ultra low profile socket strips (CLP Series). They can achieve a low 3,50mm (.137") profile, or up to 11,80mm (.465") in height. Headers on .050" x .100" (1,27mm x 2,54mm) |
© 1997 SAMTEC
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